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Gembird TG-G15-02 heat sink compound Thermal paste 4.63 W/m·K 24 g
Heatsink silicone thermal paste grease, 15 g
Thermal silicone compound (grease) for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive
More Information
SKU
TG-G15-02
EAN
8716309102698
Specification
Features Type Thermal paste Density 3.15 g/cm³ Constitutive ingredients Silicone Silicone percentage 15% Carbon percentage 35% Thermal resistance 0.0087 °C/W Viscosity note 12500 Pa s Thermal conductivity 4.63 W/m·K Operating temperature (T-T) -30 - 280 °C Product colour Grey Certification RoHS, CE Weight & dimensions Width 30 mm Depth 35 mm Height 30 mm Weight 24 g Package width 30 mm Package depth 35 mm Package height 30 mm Package weight 30 g Packaging data Package width 30 mm Package depth 35 mm Package height 30 mm Package weight 30 g Quantity per pack 400 pc(s) Technical details Density 3.15 g/cm³ Constitutive ingredients Silicone Silicone percentage 15% Carbon percentage 35% Thermal resistance 0.0087 °C/W Viscosity note 12500 Pa s Thermal conductivity 4.63 W/m·K Operating temperature (T-T) -30 - 280 °C Certification RoHS, CE Operational conditions Operating temperature (T-T) -30 - 280 °C Colour Product colour Grey Logistics data Country of origin China Quantity per pack 400 pc(s)
Manufacturer
Gembird
Availability
In Stock
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